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: You can translate these codes back into full part numbers using the Micron FBGA and Component Marking Decoder . 2. Micron DRAM Part Numbering System
Verify the if your hardware will be deployed in extreme environments requiring industrial or automotive temperature tolerances.
| Position | Code | Meaning | | :--- | :--- | :--- | | | MT | Micron Technology (Standard Memory) | | Type | 4 | DRAM (Dynamic RAM) | | | H | Hybrid Memory Cube (HMC) | | Density | 4G | 4 Gigabits | | | 8G | 8 Gigabits | | | 16G | 16 Gigabits | | | 40 | 4 Gigabits (Alt designation) | | | 80 | 8 Gigabits (Alt designation) | | Generation | A | SDR SDRAM | | | B | DDR SDRAM | | | C | DDR2 SDRAM | | | D | DDR3 SDRAM | | | E | DDR4 SDRAM | | | F | DDR5 SDRAM | | | H | LPDDR / LPDDR2 / LPDDR3 / LPDDR4 / LPDDR5 | | | J | GDDR5 / GDDR5X / GDDR6 | | | V | RLDRAM (Reduced Latency) | | | T | Mobile LPDRAM (Low Power) | | Speed | (Varies) | Data Transfer Rate | | | DDR4 Examples: AT (DDR4-2133), 8G (DDR4-3200) | | | DDR5 Examples: BG (DDR5-4800), CK (DDR5-5600) | | | See speed tables below | | Org | 08 | x8 (8-bit wide data bus) | | | 16 | x16 (16-bit wide data bus) | | | 04 | x4 (4-bit wide data bus) | | Package | G | FBGA (Fine-pitch Ball Grid Array) | | | J | BGA (Standard Ball Grid Array) | | | M | TSOP (Thin Small Outline Package) | | Temp Grade | C | Commercial (0°C to +70°C) | | | I | Industrial (-40°C to +85°C) | | | E | Extended (-25°C to +85°C) | | | A | Automotive (-40°C to +95°C) | | | IT | Industrial Temperature (Often used in newer parts) | | Process/Rev | -XX | Die Revision or Manufacturing Process Code (e.g., -093, -AAT) |
Better to rely on Micron’s official capacity decoder:
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Micron part numbers generally consist of roughly 13 to 18 characters broken down into distinct fields. While configurations can vary slightly by product family (e.g., NAND Flash vs. DRAM), the standard format for follows this sequence:
Micron offers supplemental guides for specific product categories: FBGA and part decoder | Micron Technology Inc.
: C9 codes are often used for modules sold under the Crucial brand. 3. Decoding Framework for DRAM Components
As technology advances, DDR5 module part numbers have updated to reflect higher speeds and new power management features. MT : Micron C : DDR5 SDRAM 40 : Density (e.g., 40 = 16Gb/32Gb) F : Voltage/Die Revision S1 : Speed (e.g., 48B = DDR5-4800B) C : Module Type (e.g., C = SODIMM) 5. Summary Table for Quick Reference Code Examples Description Product 40/41/42/53 DDR4/DDR3/LPDDR2/LPDDR4 Voltage 1.2V / 1.35V / 1.8V / 1.0V Speed -25 / -187E / -093E Higher number = slower cycle time Temp IT / AT / (Blank) Industrial / Automotive / Commercial Revision :A / :B / :C Indicates die revision level
Decoding Micron memory can be tricky because the number physically printed on the chip (the
Micron uses a standardized prefix system for memory modules (DIMMs, SODIMMs, RDIMMs, LRDIMMs). The general structure is: